Feiplastic 2013, São Paulo/Brazil

20.05.-24.05.2013

  • Preview: ARBURG at Feiplastic 2013 in São Paulo
  • Joint research project: Electric EDRIVE series for high-performance injection moulding
  • HIDRIVE series: Packaging solution satisfies market requirements
  • SELOGICA “Set-up Assistant” module for efficient set-up
  • New top performance for the packaging industry